Work

Fluxless Chip to Wafer Bonding with Ultra Fine Pitch (Below 20um) Micro-Bump

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909823

Authors: Lai Yee Chia, Soon Wee Ho, Yong Liang Ye, Lin Zhou, Ling Xie, Sharon Pei Siang Lim

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Agency for Science, Technology and Research

Award: G4839195661

OpenAlex ID: W4408325818

FWCI: 2.401

Cites: 5

Cited by: 3

Related to: 10