Work

Optimization of High Aspect Ratio Copper Pillar Fabrication for Through Mold Interposer (TMI) Processing

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909833

Authors: Peh Cun Jue, Lau Boon Long, Chia Lai Yee, Ho Soon Wee

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325821

FWCI:

Cites: 7

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Related to: 10