Work

The Influence of Cu Pad Dimensions on the Thermal Expansion of Cu in Cu/SiO2 Hybrid Bonding

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909827

Authors: Siye Lee, Injoo Kim, Jinho Jang, Minji Kang, Hyein Jin, Sungdong Kim

Institution: Seoul National University of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Ministry of Trade, Industry and Energy, Korea Institute for Advancement of Technology

Award: G3845815311

OpenAlex ID: W4408325826

FWCI: 0.781

Cites: 8

Cited by: 1

Related to: 10