Work

Embedded Defect Depth Estimation Using NIR Model-Less TSOM

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909945

Authors: Jun Ho Lee, Ji Yong Joo, Jun Sung Lee, Se Jeong Kim, Oh Hyung Kwon

Institution: Kongju National University

Language: English

Topic: Image Processing Techniques and Applications

Subfield: Media Technology

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Korea Evaluation Institute of Industrial Technology

Award: G2836383096

OpenAlex ID: W4408325834

FWCI: 0.741

Cites: 7

Cited by: 1

Related to: 10