Work

Solder Ball Alloy Effect on Board Level Reliability Thermal Cycling and Vibration Test Enhancement

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909786

Authors: Fa -Chuan Chen, Kevin Yu, Shih-Chin Lin, Che-Kuan Chu, Tai-Yin Lin, Chien-Min Lin

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325835

FWCI: 0.806

Cites: 9

Cited by: 1

Related to: 10