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A Highly Integrated AiP Design for 6G Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909682

Authors: PO-I Wu, Hung-Chun Kuo, Ming-Fong Jhong, Chen-Chao Wang

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Antenna Design and Analysis

Subfield: Aerospace Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325844

FWCI: 0.865

Cites: 8

Cited by: 1

Related to: 10