Work

Elimination of Compromised Wirebonding on Ceramic MEMS Package Through Improved Process and Tooling Design

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909796

Authors: Behra E. Bamba, Michael B. Tabiera, Frederick Ray I. Gomez

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325848

FWCI: 0.781

Cites: 8

Cited by: 1

Related to: 10