Work

Novel PG IO Buses Architecture with Bond Wires to Reduce IO Buses Resistance and Provide EMI Shield

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909824

Authors: Sonal Mongia, Rishi Bhooshan, Ajay Kumar Sharma, Jasmine Lim

Language: English

Topic: VLSI and FPGA Design Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325851

FWCI:

Cites: 6

Cited by:

Related to: 10