Work

Analysis of Substrate Trace Cracking in Combined Power and Thermal Cycling Reliability Test

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909843

Authors: Manish Nayini, Ramesh Nallavelli, Yu Wei, Yeow Chon Ong, Gokul Kumar

Institutions: Micron (United States), Micron (Singapore)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325855

FWCI: 0.806

Cites: 9

Cited by: 1

Related to: 10