Work

Live Thermal Simulation Using Digital Twin for Efficient Semiconductor Layout Design

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909806

Authors: Bin He, Gongyue Tang

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: Model Reduction and Neural Networks

Subfield: Statistical and Nonlinear Physics

Field: Physics and Astronomy

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4408325868

FWCI: 2.762

Cites: 9

Cited by: 3

Related to: 10