Work

Study of Interactions Between RDL Polyimides and Underfills on Reliability of Flip-Chip Interconnects in Thermal Cycling

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909753

Authors: Hong-Da Chang, Catherine Soriano, Wen-Hsuan Chen, Hung-Chun Yang, Wei-Hong Lai, Raghunandan Chaware

Institutions: Lattice Semiconductor (United States), Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325879

FWCI:

Cites: 5

Cited by:

Related to: 10