Work

Effect of Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated on the Reliability of Transient Liquid Phase Epoxy Composite Conductive Adhesive

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909972

Authors: Chen Liang, Mingkun Yang, Zhiteng Wang, Cheng Wan, Shimeng Xu, Xiaochen Xie, Pengrong Lin, Zhibo Qu, Yong Wang, Xiuchen Zhao, Yongjun Huo, Gang Zhang

Institutions: Beijing Institute of Technology, Tsinghua University, Beijing Microelectronics Technology Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Beijing Nova Program

Awards: G391340334, G8589984350

OpenAlex ID: W4408325885

FWCI: 0.779

Cites: 22

Cited by: 1

Related to: 10