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Embedded Backside Cooling Solution for Two Stacked High-Power Chips

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909822

Authors: Xiaowu Zhang, Huicheng Feng, Gongyue Tang, Boon Long Lau, Jun Wei Javier Ong, Ming Chinq Jong, Surya Bhattacharya, Jun Li, Jing Lou

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics, Institute of High Performance Computing

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Agency for Science, Technology and Research

Award: G2596124308

OpenAlex ID: W4408325897

FWCI: 2.34

Cites: 35

Cited by: 3

Related to: 10