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Enhancing Device Performance Through Non-Pressure Sintering on Copper Leadframes

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909862

Authors: Bayaras, Abito Danila, B. Senthil Kumar, Liu Yu, Tan Tze Qing, Liao Yile, SS Kang

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325912

FWCI: 0.806

Cites: 3

Cited by: 1

Related to: 10