Work

Delamination of Temporary Bonded Wafers: An Intuitive Study

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909946

Authors: Nader Jedidi, Koen Kennes, Mario Gonzalez, Alice Guerrero, Alain Phommahaxay, Gerald Beyer, Eric Beyne

Institution: IMEC

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325935

FWCI:

Cites: 11

Cited by:

Related to: 10