Work

Analysis of Stacked Overhang Die Stress During Wire Bonding

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909830

Authors: Jing He, Yangming Liu, Yang Bo, Ning Ye

Institutions: Western Digital (China), Western Digital (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325937

FWCI:

Cites: 5

Cited by:

Related to: 10