Work

Investigation of Plasma Treatment and Bonding Parameters in Cu/SiO2 Hybrid Bonding

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909825

Authors: Injoo Kim, Siye Lee, Jinho Jang, Minji Kang, Hyein Jin, Sungdong Kim

Institution: Seoul National University of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Ministry of Trade, Industry and Energy, Korea Institute for Advancement of Technology

Award: G3845815311

OpenAlex ID: W4408325941

FWCI:

Cites: 6

Cited by:

Related to: 10