Work

Study on Microstructure and Mechanical Properties of Silver and Silver-Indium Solid Solution Films Using Magnetron Sputtering

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909869

Authors: Shuang Zhao, Pengrong Lin, Donglin Zhang, Taiyu Wang, Sichen Liu, Xiaochen Xie, Shimeng Xu, Zhibo Qu, Yong Wang, Xiuchen Zhao, Yongjun Huo

Institutions: Beijing Institute of Technology, Beijing Microelectronics Technology Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Beijing Nova Program

Awards: G391340334, G8589984350

OpenAlex ID: W4408325947

FWCI:

Cites: 26

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Related to: 10