Work

Applicability of Flash Lamp Annealing (FLA) Method on Heat Treatment Cu Thin Film and Low Dielectric Resin Films

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909754

Authors: Joo-Hyong Noh, Dong-Jae Yi, Yui Shishido, Jong-young Park, Hideo Honma

Institution: Kanto Gakuin University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325963

FWCI:

Cites: 15

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Related to: 10