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Investigation Of Multi Beam Laser Grooving Process And Die Strength for 55nm Code Low-k Wafer

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909845

Authors: Mingyue Xia, Jianhong Wang, Sean Xu, Guangming Li, H.Y Liu, Lingyan Zhu

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408325967

FWCI:

Cites: 3

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Related to: 10