Work

Study of Moisture Characteristic of Epoxy Molding Compound and Hygroscopic Swelling Warpage Thru Bi-Material Sample

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909976

Authors: Yun-Ying Chen, Ting-Wen Chen, Chai-Tien Chen, Lewis Lin, Min Chung, CL Gan, Hem Takiar

Institutions: Micron (Taiwan), Micron (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325969

FWCI: 0.806

Cites: 10

Cited by: 1

Related to: 10