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Die Chipping Measurement Using Computer Vision for Chip-to-Wafer Hybrid Bonding Application

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909766

Authors: Rahul Reddy Komatireddi, Sachin Dangayach, Rohith Cherikkallil, Prayudi Lianto, Priyanka Kanupuru

Institution: Applied Materials (United States)

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325973

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Cites: 3

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Related to: 10