Work

Selection of Non-Clean Flux for Metal TIM

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909779

Authors: Dai-Fei Li, Wen-Yu Teng, Liang-Yih Hung, Andrew Kang, Yu-Po Wang

Institution: Siliconware Precision Industries (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408325979

FWCI: 0.806

Cites: 6

Cited by: 1

Related to: 10