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Chip to Wafer and Wafer to Wafer Density Estimation and Design Rules Physical Verification

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909894

Authors: Raju Mani, Rahul Dutta, Cheemalamarri Hemanth Kumar, Vasarla Nagendra Sekhar

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Agency for Science, Technology and Research

Award: G2473869814

OpenAlex ID: W4408325996

FWCI:

Cites: 4

Cited by:

Related to: 10