Comprehensive Die Strengths Comparisons for Glass Using Different Singulation Methods for Advanced Packaging Glass-Core Substrates
Year: 2024
Type: conference-paper
Authors: Frank Wei, Andrew Frederick
Institution: Cisco Systems (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408325997