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A Novel Approach to Reduce Impedance Discontinuities for High-speed Channel in IC Packages

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909837

Authors: Jiahu Luo, Boyu Zheng, Xiaoyuan Song, Bo Jiang, Soo Lim Lee

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326003

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Cites: 5

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Related to: 10