Work

Three-Dimensional Manifold Microchannel Integrated Heat Sink for High-Performance Computing Chips

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909917

Authors: Guoran Lu, Yuxin Ye, Cheng Li, Binbin Jiao, Yanmei Kong, Ruiwen Liu

Institutions: Chinese Academy of Sciences, Institute of Microelectronics, Beijing Microelectronics Technology Institute

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4408326006

FWCI: 1.335

Cites: 6

Cited by: 1

Related to: 10