Work

Heat-resistant reliability of large-area silver microporous connections for direct cooling in power inverter applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909875

Authors: Ha-Young Yu, YehRi Kim, Dongjin Kim

Institution: Korea Institute of Industrial Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326013

FWCI:

Cites: 3

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Related to: 10