Work

Thermal Test Vehicle for Transient Thermal Characterization of Large Body Size Chips

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909826

Authors: Chen Wang, Yanbo Tang, Yin Hang, Cheng Yang, Pascale El Kallassi, Ravi Agarwal, Dongkai Shangguan, Boping Wu

Institutions: Jiangsu Changjiang Electronics Technology (China), Meta (United States), STATS ChipPAC (Singapore)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326014

FWCI: 1.612

Cites: 2

Cited by: 2

Related to: 10