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Film Assisted Molding Performance Improvement with Component Design

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909950

Authors: Hong Cheng Law, Fui Yee Lim, Boon Yew Low, Logendran Bharatham, Azaharudin Yusof, Rima Syafida Ismail, Zi Jian Pang, Denyse Shyn Yee Lim, Shea Hui Lim

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326019

FWCI:

Cites: 3

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Related to: 10