Work

Real-Time Evaluation of Effective Thermal Conductivity Profile for the Redistribution Layer (RDL)

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909817

Authors: Jun Liu, Yangfan Li, Dingjie Lu, Shuai Cao, N. Sridhar

Institutions: Agency for Science, Technology and Research, Institute of High Performance Computing

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326032

FWCI: 3.12

Cites: 11

Cited by: 4

Related to: 10