Work

An Investigation of Different Leadframe Materials with Plasma Cleaning on Extra-Large Leadframe to Study the Effects of Oxidation against Delamination

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909899

Authors: Yeechong CHUA, Boowei CHUA, Federico LEONE, Shei Meng LOO

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: STMicroelectronics

OpenAlex ID: W4408326034

FWCI: 0.806

Cites: 8

Cited by: 1

Related to: 10