Work

200mm Reconstituted Wafer for Fan-out of Microfluidics and CMOS Electronics

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909847

Authors: Wei Wei, Lei Zhang, Bert Tobback, Jakob Visker, Antonia Malainou, Tim Stakenborg, Gauri Karve, Deniz S. Tezcan

Institution: IMEC

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326036

FWCI: 0.806

Cites: 9

Cited by: 1

Related to: 10