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Dual Damascene Process for 500nm RDL Using High-Resolution Photosensitive Polymer

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909795

Authors: Carine Gerets, Nelson Pinho, Wen Hung Tseng, Tinneke Paulus, Nouha Labyedh, Gerald Beyer, Andy Miller, Eric Beyne

Institution: IMEC

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326038

FWCI: 1.612

Cites: 8

Cited by: 2

Related to: 10