Work

Signal Integrity Analysis of Dense Wire Channels on 2.5D Substrate Technologies for UCIe Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909940

Author: Mihai Dragos Rotaru

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326041

FWCI: 1.612

Cites: 5

Cited by: 2

Related to: 10