Work

Evaluation of Thermo-Mechanical Fatigue Life of Microvias Under PCB Substrate's Influence During Reflow Process

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909749

Authors: Syed Mujahid Abbas, Qiang Yu

Institution: Yokohama National University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326047

FWCI: 0.806

Cites: 19

Cited by: 1

Related to: 10