Work

Multi-RF Chip Module Through FOWLP

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909941

Authors: Serine Soh Siew Boon, David Ho Soon Wee, Chia Lai Yee, Norhanani Jaafar, Jacob Soh, Hsiao Hsiang Yao, Sharon Lim Pei Shan, Xu Feng, Ong Poh Kuan, Chan Kien Teck

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Agency for Science, Technology and Research

Award: G1483550522

OpenAlex ID: W4408326064

FWCI: 2.418

Cites: 3

Cited by: 3

Related to: 10