Work

Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909677

Authors: Chung-Hung Lai, Wei-Jie Yin, Wei-Hong Lai, Chin-Li Kao, Chen-Chao Wang, CP Hung

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326069

FWCI: 2.418

Cites: 4

Cited by: 3

Related to: 10