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Aging and Degradation Behaviour of Graphene-Enhanced Thermal Interface Materials for Large Power Electronics Module Cooling Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909787

Authors: Kristoffer Harr, Yuanyuan Wang, Jin Chen, Kurban Yasin, Anders Ekholm, Johan Liu

Institutions: Smart High Tech (Sweden), Chalmers University of Technology

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funders: Chalmers Tekniska Högskola, Science and Technology Commission of Shanghai Municipality

Award: G2834993214

OpenAlex ID: W4408326092

FWCI:

Cites: 11

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Related to: 10