Work

Analysis of SAC305/SnBi Hybrid Solder Interface and Comparison of the Relationship Between Hardness and Shear of Solder

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909968

Authors: Min-jae Sung, Sea-hwan Kim, Yeonju Go, Seung-boo Jung

Institutions: Sungkyunkwan University, Samsung Electronics (South Korea)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Korea Institute for Advancement of Technology

Award: G4979119625

OpenAlex ID: W4408326098

FWCI: 1.6

Cites: 13

Cited by: 2

Related to: 10