Work

Next Generation of Thermo-Compression Bonding Equipment

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909759

Authors: Jonathan Abdilla, Martin Kainz, Benedikt Pressl, Mario Fraubaum, Chris Scanlan

Institution: Besi (Netherlands)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326103

FWCI: 1.6

Cites: 6

Cited by: 2

Related to: 10