Work

A Quantitative Characterization of the Crack Driving Force of the Popcorn-Type Failure in Mold-Underfilled Package Under Hygro-Thermo-Vapor Loads by Finite Element Based Fracture Mechanics

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909814

Authors: Guang-Chao Lyu, Ming-Sheng Luo, Xin-Ping Zhang

Institution: South China University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326105

FWCI:

Cites: 16

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Related to: 10