Corrosion of Aluminum Pad in Fan-Out Panel Level Packaging (FOPLP)
Year: 2024
Type: conference-paper
Authors: Yeonseop Yu, Seyoon Park, Miyang Kim, Taeho Moom
Institutions: Samsung Electronics (South Korea), Samsung (South Korea)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408326126