Work

Warpage Calculation Methodology for C2W Hybrid Bonded Wafers

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909752

Authors: Vasarla Nagendra Sekhar, Goh Jun Ci, Chirantan Ganguly, Dileep Kumar Mishra, Sasi Kumar Tippabhotla, Bhesetti Chandra Rao, Vempati Srinivasa Rao

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326131

FWCI: 1.612

Cites: 8

Cited by: 2

Related to: 10