Work

Thermal Cycling Performance of Heterogeneous Sn-Ag-Cu Solder Joint with Minor Elements Addition

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909782

Authors: Joo Young Bae, Mi-Song Kim, Won Sik Hong, Sehoon Yoo, Jeong Tak Moon, Sang-Bok Park, Nam Hyun Kang

Institutions: Korea Electronics Technology Institute, Korea Institute of Industrial Technology, Pusan National University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326140

FWCI:

Cites: 19

Cited by:

Related to: 10