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Ultra-Thin ta-C Hermetic Seals for Electronics Packaging

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909848

Authors: Eric JR Phua, Tan Yik Kai, Lum Ya Woon, Li Ying, Jacob Lim, Tay Yu Shan, Gan Chee Lip, Shi Xu

Institution: Nanyang Technological University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326142

FWCI:

Cites: 14

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Related to: 10