Work

POD-ANN Thermal Modelling Framework for Rapid Thermal Analysis of 2.5D Chiplet Designs

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909871

Authors: Yangfan Li, Jun Liu, Dingjie Lu, Shuai Cao, N. Sridhar

Institutions: Agency for Science, Technology and Research, Institute of High Performance Computing

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408326147

FWCI: 4.03

Cites: 10

Cited by: 5

Related to: 10