Work

Semiconductor Chip and Package Co-Design and Assembly for Dual Use in Flip Chip and Wirebond BGA Packages

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909878

Authors: Rongrong Jiang, Trent Uehling, Bihua He, Tingdong Zhou, Meijiang Song, Azham Mohd Sukemi, Taki Fang, Roy Lo, Kaelin Wang, Roy Lo, You Ge

Institution: NXP (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326155

FWCI: 0.806

Cites: 7

Cited by: 1

Related to: 10