Work

Post-CMP Clean Optimization for SiCN Hybrid Bonding Applications

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909769

Authors: Hong-Miao Ji, Chaeeun LEE, Soon Fong TEE, Wei Jie TEO Dickson, Gee Oon TAN Irving, Nandini Venkataraman, Prayudi Lianto, Avery TAN, Joselyn LIE, Darren SUM, Kevan SEOW, Kelvin CHEOK, Hoi Jin CHONG, Dnyanesh TAMBOLI, Melvin TEO

Institutions: Agency for Science, Technology and Research, Institute of Microelectronics, Applied Materials (Singapore)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408326157

FWCI:

Cites: 7

Cited by:

Related to: 10