Effect of Wafer Backside Thin Film Thickness on Wafer Stealth Dicing Performance
Year: 2024
Type: conference-paper
Authors: Nathaniel Simon George, Dao Kun Lim, Kian Guan Khoo, Tey Jie Lin Jolyn, Ankur Harish Shah, Rommel Tanola, Mei Wen Lu, Wen How Sim, Harjashan Singh
Institution: Micron (United States)
Language: English
Subfield: Computational Mechanics
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408326162